With software now a key deliverable in semiconductor products, our customers increasingly need to develop hardware and software in parallel to hit ever-decreasing market windows, and virtual platforms are a key technique in achieving that. Our partnership with Imperas thus allows T&VS to enhance the solutions we can offer to the market. I am particularly excited by the Imperas fault injection capability which is a key verification technique in the growing safety markets such as automotive.
Andrew Schmidt
University of Southern California’s Information Sciences Institute (USC/ISI)
Imperas tools and models provide us with enhanced capabilities to pursue research we could not otherwise achieve with significantly less upfront development effort. The virtual platforms allow us to rapidly explore state-of-the-art prototypes and bridges the gap between hardware and software development.